nanotechnology

Nanotechnology

The mission of the Nanotechnology group is to operate the cleanrooms at the Laboatory for Nano and Quantum Technologies, to provide scientific and technological support to the cleanroom users and to develop novel micro- and nanofabrication techniques for success of current and future research projects. Moreover, the group is also providing nanofabication services to external academic and industrial customers.

Nanotechnology group is welcoming Kevin Hofhuis

Starting in Novemeber 2022, Dr. Kevin Anthony Hofhuis joined the Nanotechnology group as an E-beam Lithography Scientist.



Welcome to the cleanroom team, Kevin!

Keyence optical 3D Profiler

New Confocal Microscope Keyence VK-X3100

Keyence VK-X3100 is a  non-contact 3D surface profiler. It enables capturing images and performing the profile, roughness and film thickness analysis. The measurement head is equipped with semiconductor laser with the wave length of 404 nm and white LED. To reach the best performance, it uses laser confocal scanning, focus variation, adn while light interferometry  measurement methods. The motorized sample stage allows for automatic inspection of up to 200mm wafers.

Heidelberg DWL66+ at LMN

Installation of Heidelberg DWL66+

Heidelberg DWL66+ direct laser writer, funded by ANAXAM, is in operation now. It is a new photolithographic system closing the gap between the mask aligners on one side and the Nanoscribe two-photon 3D lithography system on the other. It is equipped with semiconductor laser with the wave length of 405 nm and is capable of exposing the minimum feature size down to 0.3 µm on wafers up to 200 mm or 9"x9" mask blanks.

SPTS Rapier DRIE

Installation of SPTS Rapier Deep Reactive Ion Etcher

SPTS Rapier system for Si deep reactive ion etching (DRIE) is released for user operation. The system is acquired by PSI as a part of SNF R’Equip project “Advanced Si DRIE tool for highly uniform ultra-deep structuring (SiDRY)”. This versatile tool is equipped with pulsed bias option and sensitive ClaritasTM optical end point detection system. Electrostatic clamping and wafer edge protection systems are both available for three wafer diameters – 100 mm, 150 mm, and 200 mm.