SPTS Rapier system for Si deep reactive ion etching (DRIE) is released for user operation. The system is acquired by PSI as a part of SNF R’Equip project “Advanced Si DRIE tool for highly uniform ultra-deep structuring (SiDRY)”. This versatile tool is equipped with pulsed bias option and sensitive ClaritasTM optical end point detection system. Electrostatic clamping and wafer edge protection systems are both available for three wafer diameters – 100 mm, 150 mm, and 200 mm.
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