Your tasks
- Pattern preparation of DRIE hard mask using UV lithography and plasma process
- Development of new recipes and recipe optimization (profile, aspect ratio for different feature sizes) of DRIE with SPTS tool for high aspect ratio gratings at 4-inch wafer scale
- DRIE process scaling up to 8-inch wafer scale
- Inspection with optical microscope, profilometry and SEM
- Internal data report and presentations
Your profile
We are a highly motivated and synergic team and we are passionate for challenging and non-conventional problem solving schemes. We are looking for a dynamic, hands-on person which thrives in a team environment. The successful candidate should have proven hands-on experience in clean room operation and silicon microfabrication, a master or PhD degree in Engineering, Physics, Chemistry, or Materials Science. Previous industrial experience is considered a plus. Prior experience with optical lithography, plasma physics and deep reactive ion etching (DRIE) is highly desirable. Good English and good communication skills are required.
We offer
Our institution is based on an interdisciplinary, innovative and dynamic collaboration. You will profit from a systematic training on the job, in addition to personal development possibilities and our pronounced vocational training culture. If you wish to optimally combine work and family life or other personal interests, we are able to support you with our modern employment conditions and the on-site infrastructure.
Your employment contract is limited to 2 years.
For further information, please contact Dr Lucia Romano, e-mail lucia.romano@psi.ch or Prof. Dr Marco Stampanoni, e-mail marco.stampanoni@psi.ch.
Please submit your application online by 15 September 2024 (including list of publications and addresses of referees) for the position as a Process Engineer / Postdoctoral Fellow (index no. 6111-00).
Paul Scherrer Institut, Human Resources Management, Alina Rao, 5232 Villigen PSI, Switzerland